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Rochester Electronics ADC12D1000CIUT/NOPB

IC ADC 12BIT 292BGA
part number has RoHS
Manufacturer # :ADC12D1000CIUT/NOPB
Manufacturer :Rochester Electronics
Dasenic # :ADC12D1000CIUT/NOPB-DS
Customer # :
Description : IC ADC 12BIT 292BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 568.7505$ 568.75
In Stock: 1785
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 568.7505
Total :$ 568.75
Delivery :
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ADC12D1000CIUT/NOPB information

  • Rochester Electronics ADC12D1000CIUT/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:292-BBGA
  • Input Type:-
  • Supplier Device Package:292-BGA (27x27)
  • Configuration:-
  • Sampling Rate ( Per Second):2G
  • Data Interface:-
  • Number of Bits:12
  • Voltage - Supply, Analog:-
  • Voltage - Supply, Digital:-
  • Number of Inputs:-
  • Ratio - S/ H: A D C:-
  • Number of A/ D Converters:2
  • Architecture:-
  • Reference Type:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADC12D1000CIUT/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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