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Rochester Electronics ADC10D020CIVSX/NOPB
Manufacturer # :ADC10D020CIVSX/NOPB
Manufacturer :Rochester Electronics
Dasenic # :ADC10D020CIVSX/NOPB-DS
Datasheet : ADC10D020CIVSX/NOPB Datasheet
Customer # :
Description : IC ADC 10BIT TWO-STEP 48TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 23118
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.247
Total :$ 5.25
Delivery :
Payment :
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ADC10D020CIVSX/NOPB information
Rochester Electronics ADC10D020CIVSX/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:Simultaneous Sampling
- Mounting Type:Surface Mount
- Package / Case:48-TQFP
- Input Type:Differential, Single Ended
- Supplier Device Package:48-TQFP (7x7)
- Configuration:MUX-S/H-ADC
- Sampling Rate ( Per Second):20M
- Data Interface:Parallel
- Number of Bits:10
- Voltage - Supply, Analog:2.7V ~ 3.6V
- Voltage - Supply, Digital:2.7V ~ 3.6V
- Number of Inputs:2
- Ratio - S/ H: A D C:1:2
- Number of A/ D Converters:2
- Architecture:Two-Step
- Reference Type:Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADC10D020CIVSX/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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