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Texas Instruments 74SSTUB32866AZKER

IC CONFIG REG BUFF 25BIT 96-BGA
part number has RoHS
Manufacturer # :74SSTUB32866AZKER
Manufacturer :Texas Instruments
Dasenic # :74SSTUB32866AZKER-DS
Customer # :
Description : IC CONFIG REG BUFF 25BIT 96-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.2000$ 7.2
25+$ 7.0560$ 176.4
100+$ 6.7680$ 676.8
500+$ 6.4800$ 3240
1000+$ 6.1200$ 6120
In Stock: 8956
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.2
Total :$ 7.20
Delivery :
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74SSTUB32866AZKER information

  • Texas Instruments 74SSTUB32866AZKER technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Specialty Logic
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:96-LFBGA
  • Supplier Device Package:96-PBGA MICROSTAR (13.6x5.6)
  • Supply Voltage:1.7V ~ 1.9V
  • Number of Bits:25, 14
  • Logic Type:1:1, 1:2 Configurable Registered Buffer with Parity
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74SSTUB32866AZKER provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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