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TE Connectivity 808-AG10D-ES
Manufacturer # :808-AG10D-ES
Manufacturer :TE Connectivity
Dasenic # :808-AG10D-ES-DS
Datasheet : 808-AG10D-ES Datasheet
Customer # :
Description : CONN IC DIP SOCKET 8POS GOLD
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In Stock: 2987
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.4836
Total :$ 3.48
Delivery :
Payment :
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808-AG10D-ES information
TE Connectivity 808-AG10D-ES technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Sockets for ICs, Transistors
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 105°C
- Features:Open Frame
- Mounting Type:Through Hole
- Termination:Solder
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Housing Material:Polyester
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:25.0µin (0.63µm)
- Contact Finish - Post:-
- Number of Positions or Pins ( Grid):8 (2 x 4)
- Pitch - Post:0.100" (2.54mm)
- Contact Material - Mating:Copper Alloy
- Contact Finish Thickness - Post:-
- Contact Material - Post:-
808-AG10D-ES provided by TE Connectivity
TE Connectivity Ltd. (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With more than 85,000 employees, including over 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS.
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