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  • Amphenol DILB14P-223TLF

    CONN IC DIP SOCKET 14POS TIN
  • part number has RoHS
  • Mfr.Part # :DILB14P-223TLF
  • Manufacturer :Amphenol
  • Dasenic # :DILB14P-223TLF-DS
  • Datasheet :pdf download DILB14P-223TLF Datasheet
  • Description : CONN IC DIP SOCKET 14POS TIN
  • Package :-
  • Quantity :
    Unit Price : $ 0.2606Total : $ 0.26
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 27898
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
68 +$ 0.2606$ 17.72
510 +$ 0.1921$ 97.97
2516 +$ 0.1844$ 463.95
5032 +$ 0.1816$ 913.81
7514 +$ 0.1789$ 1344.25

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Amphenol DILB14P-223TLF technical specifications, attributes, parameters.
Category:Connectors & Interconnects/Sockets for ICs, Transistors
Product Status:Active
Operating Temperature:-55°C ~ 105°C
Features:Open Frame
Mounting Type:Through Hole
Termination:Solder
Type:DIP, 0.3" (7.62mm) Row Spacing
Housing Material:Polyamide (PA), Nylon
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:100.0µin (2.54µm)
Contact Finish - Post:Tin
Number of Positions or Pins ( Grid):14 (2 x 7)
Pitch - Post:0.100" (2.54mm)
Contact Material - Mating:Copper Alloy
Contact Finish Thickness - Post:100.0µin (2.54µm)
Contact Material - Post:Copper Alloy
DILB14P-223TLF provided by Amphenol

Amphenol, one of the biggest producers of interconnect products worldwide, takes a significant part as a leader in high-growth market segmentation including Broadband Communication, Information Technology and Data Communications Equipment, Commercial Aerospace, Automotive, Mobile Devices and Wireless Infrastructure by designing, manufacturing and marketing flat-ribbon cable, coaxial and flat-ribbon cable, electronic and fiber optic connectors, electrical, and interconnect systems.

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