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Onsemi DB3
DIAC 28-36V 2A DO35
Manufacturer # :DB3
Manufacturer :Onsemi
Dasenic # :DB3-DS
Datasheet :
DB3 Datasheet
DB3 DatasheetCustomer # :
Description : DIAC 28-36V 2A DO35
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0142 | $ 0.01 |
| 10000+ | $ 0.0130 | $ 130 |
| 30000+ | $ 0.0116 | $ 348 |
| 50000+ | $ 0.0114 | $ 570 |
| 100000+ | $ 0.0108 | $ 1080 |
In Stock: 49610
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0142
Total :$ 0.01
Delivery :
Payment :
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DB3 information
Onsemi DB3 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Thyristors - DIACs, SIDACs
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TJ)
- Package / Case:DO-204AH, DO-35, Axial
- Supplier Device Package:DO-35
- Current - Hold ( Ih) ( Max):-
- Voltage - Breakover:28 ~ 36V
- Current - Breakover:100 µA
- Current - Peak Output:2 A
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DB3 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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