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Rochester Electronics XC4036XLA-09BG432C

FPGA, 1296 CLBS, 22000 GATES
part number has RoHS
Manufacturer # :XC4036XLA-09BG432C
Manufacturer :Rochester Electronics
Dasenic # :XC4036XLA-09BG432C-DS
Customer # :
Description : FPGA, 1296 CLBS, 22000 GATES
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 325.8200$ 325.82
25+$ 319.3000$ 7982.5
100+$ 306.2800$ 30628
500+$ 293.2400$ 146620
1000+$ 276.9400$ 276940
In Stock: 1516
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 325.82
Total :$ 325.82
Delivery :
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Payment :
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XC4036XLA-09BG432C information

  • Rochester Electronics XC4036XLA-09BG432C technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:432-LBGA Exposed Pad, Metal
  • Supplier Device Package:432-MBGA (40x40)
  • Voltage - Supply:-
  • Number of I/ O:-
  • Number of L A Bs/ C L Bs:1296
  • Number of Logic Elements/ Cells:-
  • Number of gates:22000
  • Total R A M bits:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:3A991D
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
XC4036XLA-09BG432C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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