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Rochester Electronics XC1701LPD8C

IC 1 MB 3.3V SER CONF PROM 8-DIP
part number has RoHS
Manufacturer # :XC1701LPD8C
Manufacturer :Rochester Electronics
Dasenic # :XC1701LPD8C-DS
Customer # :
Description : IC 1 MB 3.3V SER CONF PROM 8-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 28.2400$ 28.24
25+$ 27.6800$ 692
100+$ 26.5400$ 2654
500+$ 25.4200$ 12710
1000+$ 24.0000$ 24000
In Stock: 1501
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.24
Total :$ 28.24
Delivery :
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Payment :
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XC1701LPD8C information

  • Rochester Electronics XC1701LPD8C technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory - Configuration Proms for FPGAs
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP
  • Memory Size:1MB
  • Voltage - Supply:3V ~ 3.6V
  • Programmable Type:OTP
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
XC1701LPD8C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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