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  • Rochester Electronics UDA1334BTS/N2,112

    IC DAC/AUDIO 24BIT 100K 16SSOP
  • part number has RoHS
  • Mfr.Part # :UDA1334BTS/N2,112
  • Manufacturer :Rochester Electronics
  • Dasenic # :UDA1334BTS/N2,112-DS
  • Datasheet :pdf download UDA1334BTS/N2,112 Datasheet
  • Description : IC DAC/AUDIO 24BIT 100K 16SSOP
  • Package :-
  • Quantity :
    Unit Price : $ 0.6853Total : $ 0.69
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1577
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.6853$ 0.69
25 +$ 0.6716$ 16.79
100 +$ 0.6441$ 64.41
500 +$ 0.6168$ 308.40
1000 +$ 0.5825$ 582.50

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Rochester Electronics UDA1334BTS/N2,112 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/ADCs/DACs - Special Purpose
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:16-LSSOP (0.173", 4.40mm Width)
Type:DAC, Audio
Number of Channels:3
Supplier Device Package:16-SSOP
Voltage - Supply:1.8V ~ 3.6V
Resolution ( Bits):24 b
Sampling Rate ( Per Second):100k
Data Interface:I²S
Voltage Supply Source:Analog and Digital
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UDA1334BTS/N2,112 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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