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Rochester Electronics UCC5640PW24

IC SCSI 9-LINE TERM 24-TSSOP
part number has RoHS
Manufacturer # :UCC5640PW24
Manufacturer :Rochester Electronics
Dasenic # :UCC5640PW24-DS
Customer # :
Description : IC SCSI 9-LINE TERM 24-TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.7550$ 1.76
25+$ 1.7190$ 42.98
100+$ 1.6470$ 164.7
500+$ 1.5840$ 792
1000+$ 1.4940$ 1494
In Stock: 14371
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.755
Total :$ 1.75
Delivery :
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Payment :
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UCC5640PW24 information

  • Rochester Electronics UCC5640PW24 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Signal Terminators
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:24-TSSOP (0.173", 4.40mm Width)
  • Type:SCSI, LVD
  • Supplier Device Package:24-TSSOP
  • Voltage - Supply:2.7V ~ 5.25V
  • Number of Terminations:9
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UCC5640PW24 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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