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1 : $4.6200
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Rochester Electronics UCC3921N
POWER SUPPLY SUPPORT CIRCUIT, AD
Manufacturer # :UCC3921N
Manufacturer :Rochester Electronics
Dasenic # :UCC3921N-DS
Datasheet :
UCC3921N Datasheet
UCC3921N DatasheetCustomer # :
Description : POWER SUPPLY SUPPORT CIRCUIT, AD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 130+ | $ 4.6200 | $ 600.6 |
In Stock: 1751
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.62
Total :$ 4.62
Delivery :
Payment :
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UCC3921N information
Rochester Electronics UCC3921N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Features:UVLO
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Current - Supply:1 mA
- Type:Hot Swap Controller
- Number of Channels:1
- Supplier Device Package:8-PDIP
- Internal Switch(s):No
- Voltage - Supply:-48V
- Programmable Features:Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault
- Current - Output ( Max):-
- Applications:General Purpose
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC3921N provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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