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1 : $2.5830
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Rochester Electronics UCC3916DP
UCC3916 1.65A, 4-6V SINGLE HOT-S
Manufacturer # :UCC3916DP
Manufacturer :Rochester Electronics
Dasenic # :UCC3916DP-DS
Datasheet :
UCC3916DP Datasheet
UCC3916DP DatasheetCustomer # :
Description : UCC3916 1.65A, 4-6V SINGLE HOT-S
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.5830 | $ 2.58 |
| 25+ | $ 2.5290 | $ 63.23 |
| 100+ | $ 2.4300 | $ 243 |
| 500+ | $ 2.3220 | $ 1161 |
| 1000+ | $ 2.1960 | $ 2196 |
In Stock: 10438
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.583
Total :$ 2.58
Delivery :
Payment :
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UCC3916DP information
Rochester Electronics UCC3916DP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Features:Thermal Limit
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Current - Supply:1 mA
- Type:Hot Swap Controller
- Number of Channels:1
- Supplier Device Package:8-SOIC
- Internal Switch(s):Yes
- Voltage - Supply:4V ~ 6V
- Programmable Features:Fault Timeout
- Current - Output ( Max):1.65A
- Applications:SCSI
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC3916DP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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