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Rochester Electronics UCC3813D-3
Manufacturer # :UCC3813D-3
Manufacturer :Rochester Electronics
Dasenic # :UCC3813D-3-DS
Datasheet : UCC3813D-3 Datasheet
Customer # :
Description : IC REG CTRLR MULT TOPOLOGY 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 40212
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.035
Total :$ 1.03
Delivery :
Payment :
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UCC3813D-3 information
Rochester Electronics UCC3813D-3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Controllers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Output Type:Transistor Driver
- Supplier Device Package:8-SOIC
- Voltage - Supply ( Vcc/ Vdd):3.6V ~ 12V
- Frequency - Switching:31kHz
- Number of Outputs:1
- Topology:Boost, Flyback, Forward Converter
- Control Features:Frequency Control
- Output Configuration:Positive
- Output Phases:1
- Duty Cycle ( Max):99%
- Synchronous Rectifier:No
- Clock Sync:No
- Serial Interfaces:-
- Function:Step-Up, Step-Up/Step-Down
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC3813D-3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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