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Rochester Electronics UCC27223PWP
IC GATE DRVR HALF-BRIDG 14HTSSOP
Manufacturer # :UCC27223PWP
Manufacturer :Rochester Electronics
Dasenic # :UCC27223PWP-DS
Datasheet :
UCC27223PWP Datasheet
UCC27223PWP DatasheetCustomer # :
Description : IC GATE DRVR HALF-BRIDG 14HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.5552 | $ 1.56 |
In Stock: 28009
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.5552
Total :$ 1.56
Delivery :
Payment :
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UCC27223PWP information
Rochester Electronics UCC27223PWP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Input Type:Non-Inverting
- Supplier Device Package:14-HTSSOP
- Voltage - Supply:3.7V ~ 20V
- Channel Type:Synchronous
- Driven Configuration:Half-Bridge
- Number of Drivers:2
- Gate Type:N-Channel MOSFET
- Logic Voltage - V I L, V I H:1.55V, 2.25V
- Current - Peak Output ( Source, Sink):4A, 4A
- High Side Voltage - Max ( Bootstrap):-
- Rise / Fall Time ( Typ):17ns, 17ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC27223PWP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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