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Rochester Electronics UCC27201DG4

IC DVR HIGH/LOW SIDE 3A 8SOIC
part number has RoHS
Manufacturer # :UCC27201DG4
Manufacturer :Rochester Electronics
Dasenic # :UCC27201DG4-DS
Customer # :
Description : IC DVR HIGH/LOW SIDE 3A 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
115+$ 0.3985$ 45.83
245+$ 0.3729$ 91.36
375+$ 0.3600$ 135
540+$ 0.3343$ 180.52
705+$ 0.3214$ 226.59
In Stock: 46405
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3985
Total :$ 0.40
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UCC27201DG4 information

  • Rochester Electronics UCC27201DG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 140°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Input Type:Non-Inverting
  • Supplier Device Package:8-SOIC
  • Voltage - Supply:8V ~ 17V
  • Channel Type:Independent
  • Driven Configuration:Half-Bridge
  • Number of Drivers:2
  • Gate Type:N-Channel MOSFET
  • Logic Voltage - V I L, V I H:0.8V, 2.5V
  • Current - Peak Output ( Source, Sink):3A, 3A
  • High Side Voltage - Max ( Bootstrap):120 V
  • Rise / Fall Time ( Typ):8ns, 7ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC27201DG4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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