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Rochester Electronics UCC27200D

IC GATE DRVR HALF-BRIDGE 8SOIC
part number has RoHS
Manufacturer # :UCC27200D
Manufacturer :Rochester Electronics
Dasenic # :UCC27200D-DS
Customer # :
Description : IC GATE DRVR HALF-BRIDGE 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.5030$ 1.5
25+$ 1.4760$ 36.9
100+$ 1.4130$ 141.3
500+$ 1.3500$ 675
1000+$ 1.2780$ 1278
In Stock: 45973
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.503
Total :$ 1.50
Delivery :
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Payment :
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UCC27200D information

  • Rochester Electronics UCC27200D technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 140°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Input Type:Non-Inverting
  • Supplier Device Package:8-SOIC
  • Voltage - Supply:8V ~ 17V
  • Channel Type:Independent
  • Driven Configuration:Half-Bridge
  • Number of Drivers:2
  • Gate Type:N-Channel MOSFET
  • Logic Voltage - V I L, V I H:3V, 8V
  • Current - Peak Output ( Source, Sink):3A, 3A
  • High Side Voltage - Max ( Bootstrap):120 V
  • Rise / Fall Time ( Typ):8ns, 7ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC27200D provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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