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Rochester Electronics UCC1800L883B

UCC1800 LOW-POWER BICMOS CURRENT
part number has RoHS
Manufacturer # :UCC1800L883B
Manufacturer :Rochester Electronics
Dasenic # :UCC1800L883B-DS
Customer # :
Description : UCC1800 LOW-POWER BICMOS CURRENT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 28.7550$ 28.76
25+$ 28.1790$ 704.48
100+$ 27.0270$ 2702.7
500+$ 25.8840$ 12942
1000+$ 24.4440$ 24444
In Stock: 1521
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.755
Total :$ 28.75
Delivery :
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Payment :
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UCC1800L883B information

  • Rochester Electronics UCC1800L883B technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Controllers
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Output Type:-
  • Supplier Device Package:-
  • Voltage - Supply ( Vcc/ Vdd):-
  • Frequency - Switching:-
  • Number of Outputs:-
  • Topology:-
  • Control Features:-
  • Output Configuration:-
  • Output Phases:-
  • Duty Cycle ( Max):-
  • Synchronous Rectifier:-
  • Clock Sync:-
  • Serial Interfaces:-
  • Function:-
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC1800L883B provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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