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1 : $3.6900
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Rochester Electronics UC3861N
IC OFFLINE SWITCH MULT TOP 16DIP
Manufacturer # :UC3861N
Manufacturer :Rochester Electronics
Dasenic # :UC3861N-DS
Datasheet :
UC3861N Datasheet
UC3861N DatasheetCustomer # :
Description : IC OFFLINE SWITCH MULT TOP 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 74+ | $ 3.6900 | $ 273.06 |
In Stock: 1641
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.69
Total :$ 3.69
Delivery :
Payment :
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UC3861N information
Rochester Electronics UC3861N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Supplier Device Package:16-PDIP
- Voltage - Breakdown:-
- Power ( Watts):-
- Internal Switch(s):Yes
- Voltage - Supply ( Vcc/ Vdd):10.5V ~ 22V
- Frequency - Switching:10kHz ~ 1MHz
- Output Isolation:Non-Isolated
- Topology:Full-Bridge, Half-Bridge, Push-Pull
- Voltage - Start Up:16.5 V
- Duty Cycle:-
- Fault Protection:-
- Control Features:Soft Start
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UC3861N provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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