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Rochester Electronics UC3856NG4
Manufacturer # :UC3856NG4
Manufacturer :Rochester Electronics
Dasenic # :UC3856NG4-DS
Datasheet : UC3856NG4 Datasheet
Customer # :
Description : IC REG CTRLR MULT TOPOLOGY 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1560
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.177
Total :$ 3.18
Delivery :
Payment :
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UC3856NG4 information
Rochester Electronics UC3856NG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Controllers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Output Type:Transistor Driver
- Supplier Device Package:16-PDIP
- Voltage - Supply ( Vcc/ Vdd):7V ~ 40V
- Frequency - Switching:200kHz
- Number of Outputs:2
- Topology:Buck, Boost, Flyback, Forward Converter, Full-Bridge, Half-Bridge, Push-Pull
- Control Features:Enable, Frequency Control, Soft Start
- Output Configuration:Positive
- Output Phases:1
- Duty Cycle ( Max):47%
- Synchronous Rectifier:Yes
- Clock Sync:Yes
- Serial Interfaces:-
- Function:Step-Up, Step-Down, Step-Up/Step-Down
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UC3856NG4 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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