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Rochester Electronics UC2706N

IC GATE DRVR LOW-SIDE 16DIP
part number has RoHS
Manufacturer # :UC2706N
Manufacturer :Rochester Electronics
Dasenic # :UC2706N-DS
Customer # :
Description : IC GATE DRVR LOW-SIDE 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.6970$ 5.7
25+$ 5.5800$ 139.5
100+$ 5.3550$ 535.5
500+$ 5.1300$ 2565
1000+$ 4.8420$ 4842
In Stock: 24233
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.697
Total :$ 5.70
Delivery :
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UC2706N information

  • Rochester Electronics UC2706N technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-25°C ~ 85°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Input Type:Inverting, Non-Inverting
  • Supplier Device Package:16-PDIP
  • Voltage - Supply:5V ~ 40V
  • Channel Type:Independent
  • Driven Configuration:Low-Side
  • Number of Drivers:2
  • Gate Type:N-Channel MOSFET
  • Logic Voltage - V I L, V I H:0.8V, 2.2V
  • Current - Peak Output ( Source, Sink):1.5A, 1.5A
  • High Side Voltage - Max ( Bootstrap):-
  • Rise / Fall Time ( Typ):40ns, 30ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
UC2706N provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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