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Rochester Electronics TUSB3410VFG4

IC CONV SERIAL-TO-USB 32-LQFP
part number has RoHS
Manufacturer # :TUSB3410VFG4
Manufacturer :Rochester Electronics
Dasenic # :TUSB3410VFG4-DS
Customer # :
Description : IC CONV SERIAL-TO-USB 32-LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
8+$ 6.2060$ 49.65
18+$ 5.0921$ 91.66
28+$ 4.9330$ 138.12
38+$ 4.7739$ 181.41
49+$ 4.6148$ 226.13
In Stock: 9745
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.206
Total :$ 6.21
Delivery :
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Payment :
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TUSB3410VFG4 information

  • Rochester Electronics TUSB3410VFG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:32-LQFP
  • Interface:I²C, USB, UART
  • Supplier Device Package:32-LQFP (7x7)
  • Voltage - Supply:3V ~ 3.6V
  • Number of I/ O:4
  • Core Processor:8052
  • R A M Size:18K x 8
  • Program Memory Type:ROM (10kB)
  • Controller Series:TUSB
  • Applications:USB Serial Port Controller
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TUSB3410VFG4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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