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Rochester Electronics TT61N14KOFHPSA1
SCR MODULE 1.4KV 120A MODULE
Manufacturer # :TT61N14KOFHPSA1
Manufacturer :Rochester Electronics
Dasenic # :TT61N14KOFHPSA1-DS
Datasheet :
TT61N14KOFHPSA1 Datasheet
TT61N14KOFHPSA1 DatasheetCustomer # :
Description : SCR MODULE 1.4KV 120A MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 89.9910 | $ 89.99 |
In Stock: 1922
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 89.991
Total :$ 89.99
Delivery :
Payment :
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TT61N14KOFHPSA1 information
Rochester Electronics TT61N14KOFHPSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Thyristors - SCRs - Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Chassis Mount
- Package / Case:Module
- Structure:Series Connection - All SCRs
- Current - Hold ( Ih) ( Max):200 mA
- Voltage - Off State:1.4 kV
- Number of S C Rs, Diodes:2 SCRs
- Current - On State ( It ( A V)) ( Max):76 A
- Current - On State ( It ( R M S)) ( Max):120 A
- Voltage - Gate Trigger ( Vgt) ( Max):1.4 V
- Current - Gate Trigger ( Igt) ( Max):120 mA
- Current - Non Rep. Surge 50, 60 Hz ( Itsm):1550A @ 50Hz
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TT61N14KOFHPSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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