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Rochester Electronics TSB82AA2IPGEEP

IC LINK LAYER CONTROLLER 144LQFP
part number has RoHS
Manufacturer # :TSB82AA2IPGEEP
Manufacturer :Rochester Electronics
Dasenic # :TSB82AA2IPGEEP-DS
Customer # :
Description : IC LINK LAYER CONTROLLER 144LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 44.3800$ 44.38
10+$ 42.1200$ 421.2
25+$ 40.7400$ 1018.5
60+$ 40.4800$ 2428.8
120+$ 38.5000$ 4620
In Stock: 1520
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 44.38
Total :$ 44.38
Delivery :
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Payment :
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TSB82AA2IPGEEP information

  • Rochester Electronics TSB82AA2IPGEEP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Controllers
  • Product Status:Not For New Designs
  • Operating Temperature:-40°C ~ 85°C
  • Package / Case:144-LQFP
  • Current - Supply:-
  • Interface:PCI
  • Supplier Device Package:144-LQFP (20x20)
  • Standards:IEEE 1394a-2000, OHCI-Lynx™
  • Voltage - Supply:3V ~ 3.6V
  • Protocol:IEEE 1394
  • Function:Link Layer Controller
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TSB82AA2IPGEEP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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