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Rochester Electronics TSB12LV01BIPZT

IC LINK LAYER CONTROLLER 100TQFP
part number has RoHS
Manufacturer # :TSB12LV01BIPZT
Manufacturer :Rochester Electronics
Dasenic # :TSB12LV01BIPZT-DS
Customer # :
Description : IC LINK LAYER CONTROLLER 100TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 12.8520$ 12.85
25+$ 12.5910$ 314.78
100+$ 12.0780$ 1207.8
500+$ 11.5650$ 5782.5
1000+$ 10.9260$ 10926
In Stock: 12516
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.852
Total :$ 12.85
Delivery :
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Payment :
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TSB12LV01BIPZT information

  • Rochester Electronics TSB12LV01BIPZT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Controllers
  • Product Status:Obsolete
  • Operating Temperature:-
  • Package / Case:100-TQFP
  • Current - Supply:-
  • Interface:Parallel
  • Supplier Device Package:100-TQFP (14x14)
  • Standards:IEEE 1394-1995, 1394a-2000
  • Voltage - Supply:3.3V, 5V
  • Protocol:IEEE 1394
  • Function:Link Layer Controller
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TSB12LV01BIPZT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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