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Rochester Electronics TPS2310IPW

IC HOT SWAP CTRLR GP 20TSSOP
part number has RoHS
Manufacturer # :TPS2310IPW
Manufacturer :Rochester Electronics
Dasenic # :TPS2310IPW-DS
Customer # :
Description : IC HOT SWAP CTRLR GP 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.8000$ 1.8
25+$ 1.7640$ 44.1
100+$ 1.6920$ 169.2
500+$ 1.6200$ 810
1000+$ 1.5300$ 1530
In Stock: 8166
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.8
Total :$ 1.80
Delivery :
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Payment :
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TPS2310IPW information

  • Rochester Electronics TPS2310IPW technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:Latched Fault, UVLO
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width)
  • Current - Supply:500 µA
  • Type:Hot Swap Controller
  • Number of Channels:2
  • Supplier Device Package:20-TSSOP
  • Internal Switch(s):No
  • Voltage - Supply:3V ~ 13V, 3V ~ 5.5V
  • Programmable Features:Circuit Breaker, Fault Timeout, Slew Rate
  • Current - Output ( Max):-
  • Applications:General Purpose
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TPS2310IPW provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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