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Rochester Electronics TPIC44H01DAG4

IC GATE DRVR HIGH-SIDE 32TSSOP
part number has RoHS
Manufacturer # :TPIC44H01DAG4
Manufacturer :Rochester Electronics
Dasenic # :TPIC44H01DAG4-DS
Customer # :
Description : IC GATE DRVR HIGH-SIDE 32TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.0970$ 2.1
10+$ 2.0628$ 20.63
25+$ 2.0286$ 50.72
In Stock: 1528
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.097
Total :$ 2.10
Delivery :
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Payment :
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TPIC44H01DAG4 information

  • Rochester Electronics TPIC44H01DAG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:32-TSSOP (0.240", 6.10mm Width)
  • Input Type:Non-Inverting
  • Supplier Device Package:32-TSSOP
  • Voltage - Supply:4.5V ~ 5.5V
  • Channel Type:Independent
  • Driven Configuration:High-Side
  • Number of Drivers:4
  • Gate Type:N-Channel MOSFET
  • Logic Voltage - V I L, V I H:-
  • Current - Peak Output ( Source, Sink):-
  • High Side Voltage - Max ( Bootstrap):-
  • Rise / Fall Time ( Typ):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TPIC44H01DAG4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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