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  • Rochester Electronics TPA6205A1DGNG4

    IC AMP CLASS AB MONO 1.25W 8MSOP
  • part number has RoHS
  • Mfr.Part # :TPA6205A1DGNG4
  • Manufacturer :Rochester Electronics
  • Dasenic # :TPA6205A1DGNG4-DS
  • Datasheet :pdf download TPA6205A1DGNG4 Datasheet
  • Description : IC AMP CLASS AB MONO 1.25W 8MSOP
  • Package :-
  • Quantity :
    Unit Price : $ 0.2232Total : $ 0.22
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 24539
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
205 +$ 0.2232$ 45.76
435 +$ 0.2088$ 90.83
670 +$ 0.2016$ 135.07
965 +$ 0.1872$ 180.65
1250 +$ 0.1800$ 225.00

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Rochester Electronics TPA6205A1DGNG4 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Amplifiers - Audio
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Features:Depop, Differential Inputs, Shutdown, Thermal Protection
Mounting Type:Surface Mount
Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Type:Class AB
Output Type:1-Channel (Mono)
Supplier Device Package:8-HVSSOP
Voltage - Supply:2.5V ~ 5.5V
Max Output Power x Channels @ Load:1.25W x 1 @ 8Ohm
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.33.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA6205A1DGNG4 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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