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Rochester Electronics TPA6110A2DGNG4

IC AMP CLASS AB STER 150MW 8MSOP
part number has RoHS
Manufacturer # :TPA6110A2DGNG4
Manufacturer :Rochester Electronics
Dasenic # :TPA6110A2DGNG4-DS
Customer # :
Description : IC AMP CLASS AB STER 150MW 8MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.6550$ 0.66
25+$ 0.6419$ 16.05
100+$ 0.6157$ 61.57
500+$ 0.5895$ 294.75
1000+$ 0.5567$ 556.7
In Stock: 16440
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.655
Total :$ 0.66
Delivery :
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Payment :
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TPA6110A2DGNG4 information

  • Rochester Electronics TPA6110A2DGNG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
  • Type:Class AB
  • Output Type:Headphones, 2-Channel (Stereo)
  • Supplier Device Package:8-HVSSOP
  • Voltage - Supply:2.5V ~ 5.5V
  • Max Output Power x Channels @ Load:150mW x 2 @ 16Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA6110A2DGNG4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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