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1 : $0.2828
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Rochester Electronics TPA6101A2DGK
AUDIO AMPLIFIER, 2 CHANNEL(S)
Manufacturer # :TPA6101A2DGK
Manufacturer :Rochester Electronics
Dasenic # :TPA6101A2DGK-DS
Datasheet :
TPA6101A2DGK Datasheet
TPA6101A2DGK DatasheetCustomer # :
Description : AUDIO AMPLIFIER, 2 CHANNEL(S)
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2828 | $ 0.28 |
| 25+ | $ 0.2771 | $ 6.93 |
| 100+ | $ 0.2658 | $ 26.58 |
| 500+ | $ 0.2545 | $ 127.25 |
| 1000+ | $ 0.2404 | $ 240.4 |
In Stock: 1740
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2828
Total :$ 0.28
Delivery :
Payment :
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TPA6101A2DGK information
Rochester Electronics TPA6101A2DGK technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Type:Class AB
- Output Type:Headphones, 2-Channel (Stereo)
- Supplier Device Package:8-VSSOP
- Voltage - Supply:1.6V ~ 3.6V
- Max Output Power x Channels @ Load:50mW x 2 @ 16Ohm
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA6101A2DGK provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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