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Rochester Electronics TPA3123D2PWP

IC AMP CLASS D STER 25W 24HTSSOP
part number has RoHS
Manufacturer # :TPA3123D2PWP
Manufacturer :Rochester Electronics
Dasenic # :TPA3123D2PWP-DS
Customer # :
Description : IC AMP CLASS D STER 25W 24HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
25+$ 1.8198$ 45.5
53+$ 1.7028$ 90.25
83+$ 1.6443$ 136.48
118+$ 1.5264$ 180.12
154+$ 1.4679$ 226.06
In Stock: 16862
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.8198
Total :$ 1.82
Delivery :
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Payment :
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TPA3123D2PWP information

  • Rochester Electronics TPA3123D2PWP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:24-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Type:Class D
  • Output Type:2-Channel (Stereo)
  • Supplier Device Package:24-HTSSOP
  • Voltage - Supply:10V ~ 30V
  • Max Output Power x Channels @ Load:25W x 2 @ 4Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA3123D2PWP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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