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Rochester Electronics TPA3113D2PWP

IC AMP CLASS D STER 6W 28HTSSOP
part number has RoHS
Manufacturer # :TPA3113D2PWP
Manufacturer :Rochester Electronics
Dasenic # :TPA3113D2PWP-DS
Customer # :
Description : IC AMP CLASS D STER 6W 28HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
145+$ 0.3168$ 45.94
350+$ 0.2601$ 91.04
540+$ 0.2520$ 136.08
740+$ 0.2439$ 180.49
955+$ 0.2358$ 225.19
In Stock: 58200
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3168
Total :$ 0.32
Delivery :
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Payment :
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TPA3113D2PWP information

  • Rochester Electronics TPA3113D2PWP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:28-PowerTSSOP (0.173", 4.40mm Width)
  • Type:Class D
  • Output Type:2-Channel (Stereo)
  • Supplier Device Package:28-HTSSOP
  • Voltage - Supply:8V ~ 26V
  • Max Output Power x Channels @ Load:6W x 2 @ 8Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA3113D2PWP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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