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Rochester Electronics TP3070V-XG

IC COMBO II PCM FILTER 28PLCC
part number has RoHS
Manufacturer # :TP3070V-XG
Manufacturer :Rochester Electronics
Dasenic # :TP3070V-XG-DS
Customer # :
Description : IC COMBO II PCM FILTER 28PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 48.7285$ 48.73
25+$ 47.7672$ 1194.18
100+$ 45.7707$ 4577.07
500+$ 43.8482$ 21924.1
1000+$ 41.4081$ 41408.1
In Stock: 1502
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 48.7285
Total :$ 48.73
Delivery :
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Payment :
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TP3070V-XG information

  • Rochester Electronics TP3070V-XG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - CODECs
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:28-LCC (J-Lead)
  • Type:PCM, Filter
  • Supplier Device Package:28-PLCC (11.51x11.51)
  • Resolution ( Bits):-
  • Data Interface:PCM Audio Interface
  • Voltage - Supply, Analog:±5V
  • Voltage - Supply, Digital:±5V
  • Number of A D Cs / D A Cs:1 / 1
  • Sigma Delta:No
  • S/ N Ratio, A D Cs / D A Cs (db) Typ:-
  • Dynamic Range, A D Cs / D A Cs (db) Typ:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TP3070V-XG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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