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Rochester Electronics TP3054BN

IC PCM CODEC & FILTER 16-DIP
part number has RoHS
Manufacturer # :TP3054BN
Manufacturer :Rochester Electronics
Dasenic # :TP3054BN-DS
Customer # :
Description : IC PCM CODEC & FILTER 16-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.7370$ 1.74
25+$ 1.7010$ 42.53
100+$ 1.6290$ 162.9
500+$ 1.5660$ 783
1000+$ 1.4760$ 1476
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.737
Total :$ 1.74
Delivery :
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Payment :
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TP3054BN information

  • Rochester Electronics TP3054BN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - CODECs
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Type:PCM, Filter
  • Supplier Device Package:16-PDIP
  • Resolution ( Bits):-
  • Data Interface:Serial
  • Voltage - Supply, Analog:±5V
  • Voltage - Supply, Digital:±5V
  • Number of A D Cs / D A Cs:1 / 1
  • Sigma Delta:No
  • S/ N Ratio, A D Cs / D A Cs (db) Typ:-
  • Dynamic Range, A D Cs / D A Cs (db) Typ:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.31.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TP3054BN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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