Name: TP11362AV
Brand: Rochester Electronics
SKU: DS-5735646
Price: 10.1 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $10.1000

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Rochester Electronics TP11362AV

ADPCM CODEC, A/MU-LAW, 1-FUNC

Manufacturer # :TP11362AV

Manufacturer :Rochester Electronics

Dasenic # :TP11362AV-DS

Datasheet :

TP11362AV Datasheet

Customer # :

Customer #

Description : ADPCM CODEC, A/MU-LAW, 1-FUNC

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
1+	$ 10.1000	$ 10.1
25+	$ 9.9000	$ 247.5
100+	$ 9.5000	$ 950
500+	$ 9.1000	$ 4550
1000+	$ 8.5800	$ 8580

In Stock: 1503

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 10.1

Total :$ 10.10

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TP11362AV information

Rochester Electronics TP11362AV technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Telecom
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:28-LCC (J-Lead)
Current - Supply:7mA
Interface:PCM, Serial
Supplier Device Package:28-PLCC (11.43x11.43)
Number of Circuits:4
Power ( Watts):35 mW
Voltage - Supply:5V
Function:Adaptive Differential Pulse Code Modulation (ADPCM) Transcoder
EU RoHS Status:RoHS non-compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Affected
US ECCN:5A991C1
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Rochester Electronics TP11362AV
Datasheet:
TP11362AV,

Rochester Electronics TP11362AV Environmental and export classification status description
The Texas Instruments TP11362AV is a high-performance system-in-package (SiP) solution that typically combines a power management IC, microcontroller, and related components in a single package. It is designed to provide various functions efficiently for specific applications. Functions: 1. Power Management: Efficiently manages power distribution and consumption. 2. Microcontroller: Provides processing capabilities for controlling functions. 3. Integrated Components: Combines multiple functions in a single package for a more compact and integrated solution. Applications: 1. Portable and Consumer Electronics: Used in smartphones, tablets, and wearables for power management. 2. Internet of Things (IoT) Devices: Enables power-efficient operation in connected devices. 3. Industrial Automation: Provides control and power management in industrial systems. 4. Automotive Electronics: Used for power management and control in vehicles. Alternative Components: 1. Analog Devices ADP1074: A similar power management IC with integrated features. 2. ON Semiconductor NCP303: Power management IC with different configurations and capabilities. 3. Maxim Integrated MAX32625: Microcontroller with advanced processing capabilities. Embedded Modules: 1. Bluetooth Low Energy (BLE) Module: Adds wireless connectivity capabilities to the TP11362AV. 2. Sensor Module: Integrates sensors for data collection and monitoring applications. 3. Display Module: Provides interface options for graphical user interfaces in devices. Related Q&A: 1. Q: Can the Texas Instruments TP11362AV be used in battery-powered devices? A: Yes, the TP11362AV's power management features make it suitable for efficient use in battery-powered devices. 2. Q: How can the TP11362AV help in reducing the overall size of a product? A: By integrating multiple components in a single package, the TP11362AV can significantly reduce the footprint and complexity of the overall product design. 3. Q: What are some common protection features in the TP11362AV? A: The TP11362AV may include over-voltage protection, over-current protection, and thermal shutdown to ensure system safety and reliability. 4. Q: Is the Texas Instruments TP11362AV programmable? A: Depending on the microcontroller included, the TP11362AV may offer some level of programmability for customized functions and features. 5. Q: Can the TP11362AV be used in harsh environments? A: While not specifically ruggedized, the TP11362AV can be used in controlled environments with proper consideration for temperature and humidity factors.

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
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FedEx	3-7 business days
UPS	5-7 business days

TP11362AV provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.