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Rochester Electronics TND322VD-TL-E

IC DVR EXPD 25V 0.8A VEC8
part number has RoHS
Manufacturer # :TND322VD-TL-E
Manufacturer :Rochester Electronics
Dasenic # :TND322VD-TL-E-DS
Customer # :
Description : IC DVR EXPD 25V 0.8A VEC8
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0090$ 0.01
10+$ 0.0090$ 0.09
100+$ 0.0090$ 0.9
500+$ 0.0090$ 4.5
1000+$ 0.0090$ 9
In Stock: 8538
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
Delivery :
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Payment :
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TND322VD-TL-E information

  • Rochester Electronics TND322VD-TL-E technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SMD, Flat Lead
  • Technology:-
  • Interface:-
  • Supplier Device Package:SOT-28FL/VEC8
  • Voltage - Supply:4.5V ~ 25V
  • Current - Output / Channel:-
  • Current - Peak Output:800mA
  • Fault Protection:-
  • Output Configuration:Half Bridge
  • Load Type:-
  • Rds On ( Typ):11Ohm
  • Voltage - Load:-
  • Applications:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TND322VD-TL-E provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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