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Rochester Electronics TMS32C6414EZLZA6E3

IC FIXED POINT DSP 532-FCBGA
part number has RoHS
Manufacturer # :TMS32C6414EZLZA6E3
Manufacturer :Rochester Electronics
Dasenic # :TMS32C6414EZLZA6E3-DS
Customer # :
Description : IC FIXED POINT DSP 532-FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 149.7150$ 149.72
25+$ 146.7180$ 3667.95
100+$ 140.7330$ 14073.3
500+$ 134.7480$ 67374
1000+$ 127.2600$ 127260
In Stock: 3726
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 149.715
Total :$ 149.72
Delivery :
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TMS32C6414EZLZA6E3 information

  • Rochester Electronics TMS32C6414EZLZA6E3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:532-BFBGA, FCBGA
  • Type:Fixed Point
  • Interface:Host Interface, McBSP
  • Supplier Device Package:532-FCBGA (23x23)
  • Clock Rate:600MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:1.03MB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.40V
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Affected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS32C6414EZLZA6E3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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