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Rochester Electronics TMS32C6414EZLZA5E0

IC FIXED POINT DSP 532-FCBGA
part number has RoHS
Manufacturer # :TMS32C6414EZLZA5E0
Manufacturer :Rochester Electronics
Dasenic # :TMS32C6414EZLZA5E0-DS
Customer # :
Description : IC FIXED POINT DSP 532-FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 128.3220$ 128.32
25+$ 125.7570$ 3143.93
100+$ 120.6270$ 12062.7
500+$ 115.4880$ 57744
1000+$ 109.0710$ 109071
In Stock: 1636
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 128.322
Total :$ 128.32
Delivery :
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Payment :
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TMS32C6414EZLZA5E0 information

  • Rochester Electronics TMS32C6414EZLZA5E0 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:532-BFBGA, FCBGA
  • Type:Fixed Point
  • Interface:Host Interface, McBSP
  • Supplier Device Package:532-FCBGA (23x23)
  • Clock Rate:500MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:1.03MB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.20V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS32C6414EZLZA5E0 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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