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Rochester Electronics TMS320VC5501PGF300
IC FXD-PNT DSP 600 MIPS 176-LQFP
Manufacturer # :TMS320VC5501PGF300
Manufacturer :Rochester Electronics
Dasenic # :TMS320VC5501PGF300-DS
Datasheet :
TMS320VC5501PGF300 Datasheet
TMS320VC5501PGF300 DatasheetCustomer # :
Description : IC FXD-PNT DSP 600 MIPS 176-LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 9.1539 | $ 9.15 |
| 10+ | $ 6.5034 | $ 65.03 |
| 40+ | $ 6.3612 | $ 254.45 |
| 80+ | $ 5.9724 | $ 477.79 |
| 240+ | $ 5.6709 | $ 1361.02 |
In Stock: 15840
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.1539
Total :$ 9.15
Delivery :
Payment :
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TMS320VC5501PGF300 information
Rochester Electronics TMS320VC5501PGF300 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:176-LQFP
- Type:Fixed Point
- Interface:Host Interface, I²C, McBSP, UART
- Supplier Device Package:176-LQFP (24x24)
- Clock Rate:300MHz
- Non- Volatile Memory:ROM (32kB)
- On- Chip R A M:48kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.26V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320VC5501PGF300 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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