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Rochester Electronics TMS320VC5441PGF

IC FIXED POINT DSP 176-LQFP
part number has RoHS
Manufacturer # :TMS320VC5441PGF
Manufacturer :Rochester Electronics
Dasenic # :TMS320VC5441PGF-DS
Customer # :
Description : IC FIXED POINT DSP 176-LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 174.6360$ 174.64
25+$ 171.1440$ 4278.6
100+$ 164.1600$ 16416
500+$ 157.1760$ 78588
1000+$ 148.4370$ 148437
In Stock: 11044
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 174.636
Total :$ 174.64
Delivery :
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TMS320VC5441PGF information

  • Rochester Electronics TMS320VC5441PGF technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Not For New Designs
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:176-LQFP
  • Type:Fixed Point
  • Interface:Host Interface, McBSP
  • Supplier Device Package:176-LQFP (24x24)
  • Clock Rate:133MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:1.25MB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.60V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320VC5441PGF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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