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Rochester Electronics TMS320DM8147BCYE0
IC DGTL MEDIA PROCESSR 684FCBGA
Manufacturer # :TMS320DM8147BCYE0
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM8147BCYE0-DS
Datasheet :
TMS320DM8147BCYE0 Datasheet
TMS320DM8147BCYE0 DatasheetCustomer # :
Description : IC DGTL MEDIA PROCESSR 684FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 60+ | $ 128.4867 | $ 7709.2 |
In Stock: 2035
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 128.4867
Total :$ 128.49
Delivery :
Payment :
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TMS320DM8147BCYE0 information
Rochester Electronics TMS320DM8147BCYE0 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 90°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:684-BFBGA, FCBGA
- Type:Digital Media System-on-Chip (DMSoC)
- Interface:CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
- Supplier Device Package:684-FCBGA (23x23)
- Clock Rate:600MHz DSP, 720MHz ARM®
- Non- Volatile Memory:ROM (48kB)
- On- Chip R A M:1.08MB
- Voltage - I/ O:1.5V, 1.8V, 3.3V
- Voltage - Core:1.1V, 1.2V, 1.35V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM8147BCYE0 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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