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  • Rochester Electronics TMS320DM6467ZUTD7

    IC DIGITAL MEDIA SOC 529-FCBGA
  • part number has RoHS
  • Mfr.Part # :TMS320DM6467ZUTD7
  • Manufacturer :Rochester Electronics
  • Dasenic # :TMS320DM6467ZUTD7-DS
  • Datasheet :pdf download TMS320DM6467ZUTD7 Datasheet
  • Description : IC DIGITAL MEDIA SOC 529-FCBGA
  • Package :-
  • Quantity :
    Unit Price : $ 116.937Total : $ 116.94
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 3786
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 116.9370$ 116.94
25 +$ 114.5970$ 2864.93
100 +$ 109.9170$ 10991.70
500 +$ 105.2460$ 52623.00
1000 +$ 99.3960$ 99396.00

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Rochester Electronics TMS320DM6467ZUTD7 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/DSP (Digital Signal Processors)
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:529-BFBGA
Type:Digital Media System-on-Chip (DMSoC)
Interface:EBI/EMI, Ethernet, HPI, I²C, McASP, PCI, SPI, UART, USB
Supplier Device Package:529-FCBGA (19x19)
Clock Rate:729MHz DSP, 364.5MHz ARM®
Non- Volatile Memory:ROM (8kB)
On- Chip R A M:248kB
Voltage - I/ O:1.8V, 3.3V
Voltage - Core:1.20V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM6467ZUTD7 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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