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Rochester Electronics TMS320DM6467CCUT6

IC DGTL MEDIA SOC 529FCBGA
part number has RoHS
Manufacturer # :TMS320DM6467CCUT6
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM6467CCUT6-DS
Customer # :
Description : IC DGTL MEDIA SOC 529FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 90.5310$ 90.53
25+$ 88.7220$ 2218.05
100+$ 85.0950$ 8509.5
500+$ 81.4770$ 40738.5
1000+$ 76.9500$ 76950
In Stock: 13971
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 90.531
Total :$ 90.53
Delivery :
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TMS320DM6467CCUT6 information

  • Rochester Electronics TMS320DM6467CCUT6 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Not For New Designs
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:529-BFBGA, FCBGA
  • Type:Digital Media System-on-Chip (DMSoC)
  • Interface:EBI/EMI, Ethernet, HPI, I²C, McASP, PCI, SPI, UART, USB
  • Supplier Device Package:529-FCBGA (19x19)
  • Clock Rate:-
  • Non- Volatile Memory:ROM (8kB)
  • On- Chip R A M:248kB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.20V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM6467CCUT6 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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