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  • Rochester Electronics TMS320DM6446BZWTA

    IC DGTL MEDIA SOC 361NFBGA
  • part number has RoHS
  • Mfr.Part # :TMS320DM6446BZWTA
  • Manufacturer :Rochester Electronics
  • Dasenic # :TMS320DM6446BZWTA-DS
  • Datasheet :pdf download TMS320DM6446BZWTA Datasheet
  • Description : IC DGTL MEDIA SOC 361NFBGA
  • Package :-
  • Quantity :
    Unit Price : $ 48.303Total : $ 48.30
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1974
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 48.3030$ 48.30
25 +$ 47.3400$ 1183.50
100 +$ 45.4050$ 4540.50
500 +$ 43.4700$ 21735.00
1000 +$ 41.0580$ 41058.00

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Rochester Electronics TMS320DM6446BZWTA technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/DSP (Digital Signal Processors)
Product Status:Not For New Designs
Operating Temperature:-40°C ~ 105°C (TC)
Mounting Type:Surface Mount
Package / Case:361-LFBGA
Type:Digital Media System-on-Chip (DMSoC)
Interface:ASP, EBI/EMI, Host Interface, I²C, SPI, UART, USB
Supplier Device Package:361-NFBGA (16x16)
Clock Rate:513MHz DSP, 256.5MHz ARM®
Non- Volatile Memory:ROM (8kB)
On- Chip R A M:160kB
Voltage - I/ O:1.8V, 3.3V
Voltage - Core:1.20V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM6446BZWTA provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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