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Rochester Electronics TMS320DM6437ZDU7

IC DGTL MEDIA PROCESSOR 376-BGA
part number has RoHS
Manufacturer # :TMS320DM6437ZDU7
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM6437ZDU7-DS
Customer # :
Description : IC DGTL MEDIA PROCESSOR 376-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 32.8320$ 32.83
25+$ 32.1750$ 804.38
100+$ 30.8610$ 3086.1
500+$ 29.5470$ 14773.5
1000+$ 27.9090$ 27909
In Stock: 1712
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 32.832
Total :$ 32.83
Delivery :
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Payment :
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TMS320DM6437ZDU7 information

  • Rochester Electronics TMS320DM6437ZDU7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:376-BBGA Exposed Pad
  • Type:Fixed Point
  • Interface:HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC
  • Supplier Device Package:376-BGA (23x23)
  • Clock Rate:700MHz
  • Non- Volatile Memory:ROM (64kB)
  • On- Chip R A M:240kB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.05V, 1.20V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM6437ZDU7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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