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Rochester Electronics TMS320DM6435ZDU5

IC DGTL MEDIA PROCESSOR 376-BGA
part number has RoHS
Manufacturer # :TMS320DM6435ZDU5
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM6435ZDU5-DS
Customer # :
Description : IC DGTL MEDIA PROCESSOR 376-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 21.7170$ 21.72
25+$ 21.2850$ 532.13
100+$ 20.4120$ 2041.2
500+$ 19.5480$ 9774
1000+$ 18.4590$ 18459
In Stock: 1983
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 21.717
Total :$ 21.72
Delivery :
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Payment :
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TMS320DM6435ZDU5 information

  • Rochester Electronics TMS320DM6435ZDU5 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:376-BBGA Exposed Pad
  • Type:Fixed Point
  • Interface:HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
  • Supplier Device Package:376-BGA (23x23)
  • Clock Rate:500MHz
  • Non- Volatile Memory:ROM (64kB)
  • On- Chip R A M:240kB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.05V, 1.20V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM6435ZDU5 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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