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Rochester Electronics TMS320DM642AGDK5

IC FIXED-POINT DSP 548-FCBGA
part number has RoHS
Manufacturer # :TMS320DM642AGDK5
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM642AGDK5-DS
Customer # :
Description : IC FIXED-POINT DSP 548-FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 45.2160$ 45.22
25+$ 44.3160$ 1107.9
100+$ 42.5070$ 4250.7
500+$ 40.6980$ 20349
1000+$ 38.4300$ 38430
In Stock: 21595
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 45.216
Total :$ 45.22
Delivery :
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TMS320DM642AGDK5 information

  • Rochester Electronics TMS320DM642AGDK5 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:0°C ~ 90°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:548-BFBGA, FCBGA
  • Type:Fixed Point
  • Interface:Host Interface, I²C, McASP, McBSP, PCI
  • Supplier Device Package:548-FC/CSP (23x23)
  • Clock Rate:500MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:160kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.20V
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM642AGDK5 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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