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Rochester Electronics TMS320DM365ZCEF
IC DIGITAL MEDIA SOC 338NFBGA
Manufacturer # :TMS320DM365ZCEF
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM365ZCEF-DS
Datasheet :
TMS320DM365ZCEF Datasheet
TMS320DM365ZCEF DatasheetCustomer # :
Description : IC DIGITAL MEDIA SOC 338NFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 160+ | $ 46.7800 | $ 7484.8 |
| 320+ | $ 45.5600 | $ 14579.2 |
In Stock: 2468
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 46.78
Total :$ 46.78
Delivery :
Payment :
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TMS320DM365ZCEF information
Rochester Electronics TMS320DM365ZCEF technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:338-LFBGA
- Type:Digital Media System-on-Chip (DMSoC)
- Interface:EBI/EMI, Ethernet, I²C, McBSP, SPI, UART, USB
- Supplier Device Package:338-BGA (13x13)
- Clock Rate:300MHz
- Non- Volatile Memory:ROM (16kB)
- On- Chip R A M:56kB
- Voltage - I/ O:1.8V, 3.3V
- Voltage - Core:1.35V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM365ZCEF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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