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Rochester Electronics TMS320DM335ZCE135

IC DIGITAL MEDIA SOC 337-NFBGA
part number has RoHS
Manufacturer # :TMS320DM335ZCE135
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM335ZCE135-DS
Customer # :
Description : IC DIGITAL MEDIA SOC 337-NFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 11.3220$ 11.32
25+$ 11.0970$ 277.43
100+$ 10.6470$ 1064.7
500+$ 10.1880$ 5094
1000+$ 9.6210$ 9621
In Stock: 1755
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.322
Total :$ 11.32
Delivery :
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TMS320DM335ZCE135 information

  • Rochester Electronics TMS320DM335ZCE135 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:337-LFBGA
  • Type:Digital Media System-on-Chip (DMSoC)
  • Interface:ASP, EBI/EMI, I²C, SPI, UART, USB
  • Supplier Device Package:337-BGA (13x13)
  • Clock Rate:135MHz
  • Non- Volatile Memory:ROM (8kB)
  • On- Chip R A M:56kB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.30V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM335ZCE135 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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