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Rochester Electronics TMS320C6743BPTP3

IC DSP FIX/FLOAT POINT 176HLQFP
part number has RoHS
Manufacturer # :TMS320C6743BPTP3
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6743BPTP3-DS
Customer # :
Description : IC DSP FIX/FLOAT POINT 176HLQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 11.1870$ 11.19
25+$ 10.9620$ 274.05
100+$ 10.5120$ 1051.2
500+$ 10.0710$ 5035.5
1000+$ 9.5130$ 9513
In Stock: 1564
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.187
Total :$ 11.19
Delivery :
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TMS320C6743BPTP3 information

  • Rochester Electronics TMS320C6743BPTP3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:176-LQFP Exposed Pad
  • Type:Fixed/Floating Point
  • Interface:EBI/EMI, Ethernet MAC, I²C, McASP, SPI, UART
  • Supplier Device Package:176-HLQFP (24x24)
  • Clock Rate:375MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:320kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.20V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6743BPTP3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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