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Rochester Electronics TMS320C6727ZDH250

IC FLOATING POINT DSP 256-BGA
part number has RoHS
Manufacturer # :TMS320C6727ZDH250
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6727ZDH250-DS
Customer # :
Description : IC FLOATING POINT DSP 256-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 24.9300$ 24.93
25+$ 24.4350$ 610.88
100+$ 23.4360$ 2343.6
500+$ 22.4370$ 11218.5
1000+$ 21.1950$ 21195
In Stock: 13491
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 24.93
Total :$ 24.93
Delivery :
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TMS320C6727ZDH250 information

  • Rochester Electronics TMS320C6727ZDH250 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 90°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Type:Floating Point
  • Interface:EBI/EMI, HPI, I²C, McASP, SPI
  • Supplier Device Package:256-BGA (17x17)
  • Clock Rate:250MHz
  • Non- Volatile Memory:ROM (384kB)
  • On- Chip R A M:288kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.20V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMS320C6727ZDH250 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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